Epoxy
EPOFIL-60 is a pigmented filled, solvent free, RoHS compliant Epoxy Compound. It is formulated and processed to obtain void free casting, potting and encapsulated components. It is ready to use filled system having low viscosity at processing temperature. It is slow curing system with low exotherm. The cured compound has RoHS compliance Good Adhesion to most organic and inorganics materials Good Mechanical and Electrical Properties Low shrinkage and exotherm. Low coefficient of linear thermal expansion. Suitable for Class F temp (155°C) Suitable for working temp -40°C to +150°C