BOSTIK
Polytec PU 1000 is a one-component, room- temperature curing, highly flexible polyurethane- adhesive with excellent electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet- dispensing or manually.