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EPOFIL-60 is a pigmented filled, solvent free, RoHS compliant Epoxy Compound. It is
formulated and processed to obtain void free casting, potting and encapsulated components. It is
ready to use filled system having low viscosity at processing temperature. It is slow curing
system with low exotherm.
The cured compound has
RoHS compliance
Good Adhesion to most organic and inorganics materials
Good Mechanical and Electrical Properties
Low shrinkage and exotherm.
Low coefficient of linear thermal expansion.
Suitable for Class F temp (155°C)
Suitable for working temp -40°C to +150°C
POLYMELT W-225S is a Thermoplastic Hot Melt adhesive, 100%
solids content. Excellent adhesion for Hot Tack. Used for various
industrial applications, DIY applications etc
POLYMELT W-124 S is a Thermoplastic Hot Melt adhesive, 100%
solids content. Excellent adhesion for Hot Tack. Used for various
industrial applications, DIY applications etc..
Born2BondTM Light Lock MV is a low-odor, low-blooming, dual
curing (contact and lightcuring), cyanoacrylate adhesive. It is
designed for bonding applications that require fast fixturing
coating or surface cure. The UV- and visible-light cure sensitivity
allows rapid bonding through transparent parts and quick curing
of light-exposed bulk or surface-coated areas, while the instant
bonding capability ensures cure between opaque substrates
(contact cure).
KEY FEATURES
→ Dual cure formulation: instant and photo-cure
→ Fixture time in 60 s (without light exposure)*
→ Can be cured with visible and UV-LED light <5 sec
→ Long open time without activation
→ Dry to touch, tack free surface cure
→ Cure-on-demand of excess material released from bondlines
→ Bonds, fills, reconstructs and coats
→ Low odor, low blooming
→ Available in a range of viscosities: MV, HV and Gel
cyanoacrylate adhesive
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