Coimbatore
08042782997
Coimbatore
08042782997
+919994550717
Chat with us

Chat with us on WhatsApp

Home
products
Quote
Menu
Epoxy

Magnet Bonding heat cure epoxy adhesive

In stock•cod not available

Contact Us

Phone Number

08042782997

Please keep 0 before dialling the number.

Email Address gk@icsolutions.in

Mon-Thu: 10 AM - 2 PM • Fri: 3 PM - 7AM

Other Website Visit our other website
Address 2002,Behind Union bank of India,Opp TVH height ,singanallur, Coimbatore-641005

Coimbatore, India, 0

Description

It is a formulated DGEBA based single component heat cure epoxy adhesive, which exhibit excellent bond strength on curing. SALIENT FEATURES: - No hassles of metering, measuring and mixing, One-shot curing, excellent bond strength, No shrinkage on setting etc, AREA OF APPLICATION: - For bonding a wide variety of substrates includes metals, ceramics, glass, rubbers and rigid plastics. Bonding of injection needles, Bonding of magnets to yoke, potting of printed circuit board etc.

Keywords

Other Products

view all

68179d65be22ee500d53ff54 Card 2

product image
Glue Stick Hot Melt Adhesive

Reach Hot melt Glue Stick Adhesive

REACH-compliant hot melt glue sticks are specialized adhesives certified to meet the European Union's strict safety standards for human health and the environment. The acronym REACH stands for Registration, Evaluation, Authorisation, and Restriction of Chemical

68179d65be22ee500d53ff54 Card 2

product image
Glue Stick Hot Melt Adhesive

RoHS Hot melt Glue Stick

RoHS-compliant glue sticks are specialized adhesives certified free from restricted hazardous substances like lead, mercury, and cadmium. They are primarily used in electronics manufacturing, product assembly, and industrial packaging to meet strict safety and environmental standards.

68179d65be22ee500d53ff54 Card 2

product image
Epoxy

Magnet Bonding heat cure epoxy adhesive

It is a formulated DGEBA based single component heat cure epoxy adhesive, which exhibit excellent bond strength on curing. SALIENT FEATURES: - No hassles of metering, measuring and mixing, One-shot curing, excellent bond strength, No shrinkage on setting etc, AREA OF APPLICATION: - For bonding a wide variety of substrates includes metals, ceramics, glass, rubbers and rigid plastics. Bonding of injection needles, Bonding of magnets to yoke, potting of printed circuit board etc.