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Bostik Polytec EP 630 is a professional-grade, two-component, unfilled epoxy adhesive and potting compound manufactured under Bostik's high-performance engineering lines. It is specifically designed for high-temperature stability, low viscosity, and rigorous biocompatibility requirements.🛠️ Key Technical SpecificationsChemical Base: Two-component (2-K) epoxy resin.Viscosity: Low viscosity / pourable liquid (ideal for filling fine cracks and small device potting).Temperature Range: (-55text{ }^circtext{C}) to (+230text{ }^circtext{C}).Standard Cure Schedule: 10 minutes at (150text{ }^circtext{C}) (requires thermal curing).Biocompatibility: Fully complies with USP Class VI Biocompatibility Standards.Sterilisation Resistance: Highly durable, capable of withstanding over 1,000 autoclave cycles.🎯 Primary ApplicationsBecause of its unique thermal, electrical, and medical certifications, Polytec EP 630 is widely used across specialized industries:
REACH-compliant hot melt glue sticks are specialized adhesives certified to meet the European Union's strict safety standards for human health and the environment. The acronym REACH stands for Registration, Evaluation, Authorisation, and Restriction of Chemical
RoHS-compliant glue sticks are specialized adhesives certified free from restricted hazardous substances like lead, mercury, and cadmium. They are primarily used in electronics manufacturing, product assembly, and industrial packaging to meet strict safety and environmental standards.
It is a formulated DGEBA based single component heat cure
epoxy adhesive, which exhibit excellent bond strength on curing.
SALIENT FEATURES: - No hassles of metering, measuring and mixing, One-shot
curing, excellent bond strength, No shrinkage on setting etc,
AREA OF APPLICATION: - For bonding a wide variety of substrates includes
metals, ceramics, glass, rubbers and rigid plastics. Bonding of injection needles, Bonding
of magnets to yoke, potting of printed circuit board etc.
Epoxy
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