SCHPC101 is a single part, fast drying, superior, acrylic conformal coating for printed circuit assemblies and electrical equipment. Used in all areas of high-end electronics including aerospace, military, and automotive engineering and meets Mil-I-46058C and IPC-CC-830 Qualifications. • Offers complete protection from harsh environment conditions such as high humidity, dust, corrosion, fungus, salt and thermal extremes • Suitable for LED applications due to high clarity and transparency performance • Meets MIL-I-46058C and IPC-CC-830 Qualifications • Easily reworked using solvents such as Trinity Shields thinners and strippers • High speed drying allows efficient electronic production processing • Meets the Requirement of RoHS Annex II of 2011/65/EU and Amendment (EU) 2015/863. • Coating does not contain > 0.10% of any candidate substances of very high concern (SVHC) per Article 59(10) or REACH Regulations • All materials and substances in this product have been pre-registered or are exempt from

SCHPC101 is a single part, fast drying, superior, acrylic conformal coating for printed circuit assemblies and electrical equipment. Used in all areas of high-end electronics including aerospace, military, and automotive engineering and meets Mil-I-46058C and IPC-CC-830 Qualifications. • Offers complete protection from harsh environment conditions such as high humidity, dust, corrosion, fungus, salt and thermal extremes • Suitable for LED applications due to high clarity and transparency performance • Meets MIL-I-46058C and IPC-CC-830 Qualifications • Easily reworked using solvents such as Trinity Shields thinners and strippers • High speed drying allows efficient electronic production processing • Meets the Requirement of RoHS Annex II of 2011/65/EU and Amendment (EU) 2015/863. • Coating does not contain > 0.10% of any candidate substances of very high concern (SVHC) per Article 59(10) or REACH Regulations • All materials and substances in this product have been pre-registered or are exempt from REACH Registration

RoHS-compliant glue sticks are specialized adhesives certified free from restricted hazardous substances like lead, mercury, and cadmium. They are primarily used in electronics manufacturing, product assembly, and industrial packaging to meet strict safety and environmental standards.

Thermelt HMPA Hot Melt polyamide Resin For Electronics Low Pressure Moulding Bostik Thermelt® Performance comes naturally Made from up to 90% bio-based raw materials – Bostik Thermelt® is a leading range of hot melt polyamide resins and adhesives with multiple manufacturing applications, including product assembly and low pressure moulding. The range is designed at the molecular level to support manufacturers on their sustainability journeys without compromising performance or durability

EPOFIL-60 is a pigmented filled, solvent free, RoHS compliant Epoxy Compound. It is formulated and processed to obtain void free casting, potting and encapsulated components. It is ready to use filled system having low viscosity at processing temperature. It is slow curing system with low exotherm. The cured compound has  RoHS compliance  Good Adhesion to most organic and inorganics materials  Good Mechanical and Electrical Properties  Low shrinkage and exotherm.  Low coefficient of linear thermal expansion.  Suitable for Class F temp (155°C)  Suitable for working temp -40°C to +150°C

REACH-compliant hot melt glue sticks are specialized adhesives certified to meet the European Union's strict safety standards for human health and the environment. The acronym REACH stands for Registration, Evaluation, Authorisation, and Restriction of Chemical

Born2Bond™ HMPUR HDD (Hot Melt Polyurethane Reactive) adhesives are versatile, single-component solutions capable of bonding a wide variety of substrates. Available in a range of of viscosities with varying open times, they enable precise dispensing across different applications and assembly processes. Delivering excellent bonding performance (both rigid and elastic), these High Performance HMPUR adhesives will withstand fluctuations in temperature and humidity. They also remain resistant to impact, thermal shock and chemical and organic compounds, including sweat and sebum – making them ideal for use in hand-held devices and wearable electronics.

Born2Bond™ Light Lock MV, HV, Gel and 30X are patented†, low-odor, low-blooming, dual-curing (contact and light curing) cyanoacrylate adhesives. They are designed for bonding applications that require fast fixturing, coating or surface cure. The UV and visible-light cure sensitivity allow rapid bonding through transparent parts and quick curing of light-exposed bulk or surface-coated areas. Further, the product’s instant bonding capability ensures cure between opaque substrates (contact cure)

Polytec PU 1000 is a one-component, room- temperature curing, highly flexible polyurethane- adhesive with excellent electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet- dispensing or manually.