Encapsulation of Electronic Components in coimbatore
Epoxy and acrylate resin based sealing and molding compounds are often used in electronics to protect electronic components, semiconductors and subassemblies. The encapsulation protects components from moisture, dust, dirt and solvents. Used to fill cavities or encapsulate components, sealing compounds also provide effective protection from mechanical stress.
All Panacol sealing compounds are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.
Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production.
